The world’s largest contract chipmaker says it will produce advanced 3-nanometer semiconductors in Japan.
Taiwan Semiconductor Manufacturing Company Chief Executive Officer C.C. Wei notified Japanese Prime Minister Takaichi Sanae of this plan during their meeting on Thursday in Tokyo. If realized, it would be the first output of 3-nanometer chips in Japan.
Wei said: “The 3-nanometer technology today is the most advanced process used by AI and smartphone products. We believe this fab will further contribute to local economic growth and, most importantly, form the foundation of Japan’s AI business.”
Takaichi said: “We will promote investments in crisis management and economic growth through public-private collaboration. AI and semiconductors are key sectors and the partnership with TSMC will be a model.”
The Prime Minister vowed to extend government support for the plan.
The Taiwan-based chipmaker’s first factory in Japan was put into full operation in 2024 in the southwestern prefecture of Kumamoto. It makes 12- to 28-nanometer-class chips that are used for automobiles and industrial equipment. The company is now building a second plant on the same premises.
The 3-nanometer chips are expected to be used in high-demand applications such as AI data centers and autonomous vehicles.